NanoVision

Advanced, low cost, 200-150mm silicon and SOI wafer inspection.

AltaSight 200 combines Altatech's topography and reflectivity technologies in order to characterize the front and back side of the substrate’s surface, at 100 wafers per hour.

AltaSight 200 can also be configured according to specific applications.

Macro inspection

• Large defects 20 to 60µm range
• Frontside, backside
• Fully automated
• ADC

Advanced macro inspection

• Resolution in 1 to 5µm range
• Frontside, backside
• Fully automated
• ADC

Specifications

• Throughput guaranteed at 100 wafers/hour
• Automatic defect classification
• KLARF result file
• Semi standard compliant

AltaSight key elements

• High reliability by design
• Vertical wafer holder for low stress and particle reduction
• Defects images recorded on the fly for offline review